PREMA owns with Modus U6 a fabrication process that ranks among the most modern and most stable wafer fab technologies due a unique implantation technique. This very high voltage technique offers a multitude of basic cells and combinations of elements that would be very costly to achieve using conventional technologies.

The ModuS U6 technology exhibits unmatched process stability and needs in its minimal version only eight production layers. This increases the yield and allows a very rapid wafer production.

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Automated wafer fabrication

The PREMA SEMIC® chamber technology

Your ASICs will be produced on 6" or 8" wafers in a wafer fabrication plant in our facility in Mainz (Germany). Our fab incorporates the best concepts presently known, regarding flexibility, economy and process optimization. PREMA has developed the SEMIC® chamber (Standard Electronic and Mechanical Interface Clean Chamber). Autonomous local ultra-clean rooms, conceived and equipped with standardized electronic and mechanical components and interfaces for each of the numerous tools, and interconnected by a network, forming a highly flexible system of automated workstations.

A thorough compilation of production steps combined in one SEMIC® chamber guarantees optimum flexibility in the face of changing process demands and production volumes, providing a fast and reliable process flow at the same time. The status of each wafer can be monitored centrally at all times.

PREMA has developed the SEMIC® concept to comply with the increasing demands of semiconductor manufacturing, and to cope with the exploding costs connected with many technologies. Thus we have created a new leading concept for the design of wafer processing facilities.
Our customers profit from the PREMA production concept by achieving maximum economy, security of production, transparency of process flow and flexibility.