German
Wafer Production with Smart-BCD High Voltage Process
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With Smart-BCD technology PREMA has developed an
advanced Smart-BCD process that ranks among the most modern and most stable wafer fab technologies. This very high voltage process offers a multitude of basic cells and combinations of elements that would be very costly to achieve using conventional technologies.

The Smart-BCD technology exhibits an unmatched process stability and needs in its minimal version only eight production layers. This increases the yield and allows very rapid prototyping.
 
The masks (reticles) for your ASIC are produced by the in-house e-beam
mask shop.