ASIC Test and Quality
	PREMA ASICS Application Examples The Way to your ASIC Integration, your Benefit ASIC DESIGN ASIC Functions Chip Design Tools IC Design Seminar WAFER PRODUCTION ModuS U6 ASIC Process Clean Room Technology Quality Management PREMA SEMICONDUCTOR About us Press Our City Imprint CONTACT INFO Brochure Request Distributors How to find PREMA Jobs & Careers	We optically and electronically inspect the wafers that leave the production line. Using standardized test structures, we check all basic components parameters for the specified limits. Afterwards the wafers are exposed to further tests.   ISO9001 Certificate
		All ICs on the wafer are tested first by our quality department. At the same time voltage references or other circuit blocks can be trimmed, if necessary. IC testing is based on your requirement, as the release of the pre-series ICs is done by your company's experts. The tested wafers will then be sawn, bonded and encapsulated. All common PDIP, SOP and SSOP packages are available. Other package types can also be offered upon request (f.e. Flip Chip). To complete the production cycle, all encapsulated parts must pass another complete IC inspection, before the final shipment to you is initiated. Additional test procedures, such as burn-in, are available on demand. Our production and test flow, based on certified ISO 9001 quality standards, assures a high quality level and a long lifetime of all parts produced in our facility. Quality is of highest importance for your product's success - ASICs made by PREMA provide an important basis for this.